Manufactures multifunctional microassembly systems for the photonic, optoelectronic, and semiconductor markets. Systems can pick up, align, and place a device to within 3 microns post bond. Eutectic bonding, dispensing, sorting, feeding, and ultrasonic options available.
Established: 1960
Employees: 45
Facility area (sq ft): 30,000
Ownership type: Privately Owned