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Map#2 Yishun Ave. 7
Singapore 768924
Phone: +65 6752 6311
Specializes in the supply of semiconductor assembly and packaging equipment and materials as well as surface mount technology solutions. Offers high placement accuracy die bonders for Si photonic laser to wafer die bonders with in situ laser reflow available.
Established: 1975
Ownership type: Publicly Traded Stock
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