Photonics SuppliersLaser Diode Packaging Materials

Sub. of ASMPT Ltd.

MapMarie-Curie-Str. 6
93055 Regensburg
Phone: +49 941 208 2090
Fax: +49 941 208 209999
Worldwide manufacturer of ultrahigh precision die attach equipment specializing in submicron placement accuracy (0.2 microns at 3 s). Provides die attach and flip chip bonders with focus on: opto, silicon photonics, AOC, VCSEL, laser diode, WLP, 2.5D/3D IC, TSV, TCB, fanout/EWLP, automotive sensors/lidar and MTB for advanced LED displays.
Established: 2001
Employees: 130
Ownership type: Publicly Traded Stock
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