Precision machining of hard, brittle materials including glass, quartz, sapphire, alumina, silicon carbide, and other technical ceramics. Ultrasonic machining, microabrasive jet machining and CNC machining. Single- and double-sided polished borosilicate wafers. Prototype through production. Advanced metrology capabilities. ISO 9001:2015.
Established: 1971
Ownership type: Privately Owned