Finetech
560 E Germann Rd. #103
Gilbert, AZ 85297
United States
Submicron bonders for photonics packaging, assembly and die attach: laser bars/diodes, VCSELs, Si photonics, sensors, flip chip, LEDs, transceivers. Manual to automated models provide a prototype to production pathway with high process flexibility: thermocompression, ultrasonic, eutectic, epoxy, sintering, ACF/ACP, indium, and bonding in vacuum.
Established: 1992
Ownership type: Privately Owned
Green Manufacturing
Green Facility
FINETECH PRODUCT AND SERVICE CATEGORIES
MS=Manufacture Stock | MC=Manufacture Custom | S=Supply/Distribute | D=Design