Phone: +1 503-828-0040
Fax: +1 503-828-0040
Toll-free: +1 800-430-8210
Offers solutions to alleviate the challenges of cleaving and scribing. Methods enable precise downsizing of GaAs, sapphire, InP, SiC, glass and other brittle materials. Specializes in cleaving large samples and singulating laser bars with optical finish results.
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