This system leverages TLS-Dicing™ (thermal laser separation) – a technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with excellent edge quality while increasing manufacturing yield and throughput.
Technologie-Campus 8
09126 Chemnitz
Germany
Phone: +49 371 40043 222
Fax: +49 371 40043 40