Close

Search

Search Menu
Photonics Media Photonics Marketplace Photonics Spectra BioPhotonics Vision Spectra Photonics Showcase Photonics ProdSpec Photonics Handbook
Bandwidth10 - Cutting Edge Tunable Laser Solutions BiOS LB

microDICE™


This system leverages TLS-Dicing™ (thermal laser separation) – a technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with excellent edge quality while increasing manufacturing yield and throughput.
microDICE™

3D-Micromac AG
Technologie-Campus 8
09126 Chemnitz
Germany
Phone: +49 371 40043 222
Fax: +49 371 40043 40
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2023 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, [email protected]

Photonics Media, Laurin Publishing
x Wish you were here? Click to become an exhibitor today.
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.