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Deposition Sciences Inc. (DSI)
3300 Coffey Lane
Santa Rosa, CA 95403
United States

Full Company Details
Phone: +1 707-573-6700
Toll-free: +1 866-433-7724
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Deposition Sciences Inc. (DSI)

Solderable Face Metallization
  • Type: Other
  • Diameter / Dimension: 100mm - 200mm
  • Applications: Communications, Industrial, Military
  • Coating Thickness Var: ≤10% (for 200 mm wafer)
  • Metallization Thickness: 30-100 nm adhesion layer
  • Metallization Thickness: 100-600 nm for diffusion
  • Metallization Thickness: 50-150 nm for solderable

Maximum processing temperature of 100 °C.
Metal stacks: Titanium/Platinum/Gold and Titanium/Nickel/Gold
Substrate sizes: 100 mm, 150 mm and 200 mm diameter.
Most common to metallize: Silicon device wafers however all common substrate materials can be accommodated with photolithography employed to provide patterning, if desired.
Solderable Face Metallization
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