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Bandwidth10 - Cutting Edge Tunable Laser Solutions BiOS LB

Laser Diode Cleaver LDH-30TS

  • Model: Laser Diode Cleaver LDH-30TS
  • Company: Opto System Co. Ltd.
  • Type: Other
  • Optics Compatibility: Spherical, Prisms & Wedges
  • Diameter / Dimension: 50mm
  • Width: 730mm
  • Height: 1415mm
  • Length: 850mm
  • Volts: 100
  • Amps: 500
  • Wafer Size: 4 inch
  • Power Supply: AC100V 500VA
  • Vacuum: Factory Supply
  • Air Supply: 4Kg/cm2  Φ6mm 2L/m
  • Accuracy: ±0.005mm
  • Optical System: High Magnification Camera

Opto System LDH-30TS cleaves pre-scribed laser diode bars into chips. This semi-automatic machine is equipped with a vision system that automatically align each bar before cleaving. The combination of this and other features ensures the production of high-quality mirror like facets. This machine can be used for a number of materials including InP and GaAs substrates.
Laser Diode Cleaver LDH-30TS

Opto System Co. Ltd.
100 Nogami
Miyamaki
Kyoto 610-0313
Japan
Phone: +1 415-317-4944
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