Laser Diode Cleaver LDH-30TS
- Model: Laser Diode Cleaver LDH-30TS
- Company: Opto System Co. Ltd.
- Type: Other
- Optics Compatibility: Spherical, Prisms & Wedges
- Diameter / Dimension: 50mm
- Width: 730mm
- Height: 1415mm
- Length: 850mm
- Volts: 100
- Amps: 500
- Wafer Size: 4 inch
- Power Supply: AC100V 500VA
- Vacuum: Factory Supply
- Air Supply: 4Kg/cm２ Φ6mm 2L/m
- Accuracy: ±0.005mm
- Optical System: High Magnification Camera
Opto System LDH-30TS cleaves pre-scribed laser diode bars into chips. This semi-automatic machine is equipped with a vision system that automatically align each bar before cleaving. The combination of this and other features ensures the production of high-quality mirror like facets. This machine can be used for a number of materials including InP and GaAs substrates.
100 Nogami
Miyamaki
Kyoto 610-0313
Japan
Phone: +1 415-317-4944