Search
Menu

Laser Scriber WSF4000


The Fully Automatic WSF4000 Laser Scriber is designed to scribe wafers as part of the scribe and break singulation process. The machine is equipped with a 355 nm laser that efficiently scribes Sapphire, GaN, or Si wafers to be cleaved into bars or chips. The design includes a vision system with automatic functions that accurately moves wafers to the cut position. In addition, the machine incorporates numerous features to ensure high performance safety and low cost of ownership.
Laser Scriber WSF4000

Opto System Co. Ltd.
100 Nogami
Miyamaki
Kyoto 610-0313
Japan
Phone: +1 415-317-4944
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.