Laser Scriber WSF4000

The Fully Automatic WSF4000 Laser Scriber is designed to scribe wafers as part of the scribe and break singulation process. The machine is equipped with a 355 nm laser that efficiently scribes Sapphire, GaN, or Si wafers to be cleaved into bars or chips. The design includes a vision system with automatic functions that accurately moves wafers to the cut position. In addition, the machine incorporates numerous features to ensure high performance safety and low cost of ownership.