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Optical Fabrication Equipment | OPTICS & OPTICAL FABRICATION


Photonics ProdSpec is your source for Optics & Optical Fabrication. Choose a category, filter by product specifications, view details about the products listed, and request a quote from vendors whose products fit your application.
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PromotedPREMIER PRODUCT
SOMOS TPM 400A Double-Sided Polisher
SOMOS TPM 400A Double-Sided Polisher
Universal Photonics Inc., United States
The high-powered TPM Machines deliver advanced processing solutions. The internally-cooled and thermostatically-controlled top and bottom plates facilitate continuous runs, at high speed and pressure 24 hours a day, 7 days a week. A non-contact system, the TPM's Keyence design provides real-time, digital, stock removal readout. The SOMOS TPM Series is available in a variety of sizes.
Optics Compatibility: Plano (Flat)
  • Type: Polishing
  • Width: 1.2m
  • Height: 2.1m
  • Length: 1.2m
  • Plate Size (mm): ≤ 800
  • Runtime: Continuous, 24/7
  • Readout Resolution (µ): 1
  • Control Panel: PC Touch-Screen
  • Compressed Air (psi): 100

SPCM-M1-AT50
SPCM-M1-AT50
Mildex Inc., United States
Model SPCM-M1-AT50 Automatic lens centering machine with integrated robot. This machine can load and unload parts automatically with its integrated robot. Machine is suitable to edge and bevel lenses or windows, up to 82 mm diameter.
Optics Compatibility: Spherical
  • Type: Centering & Edging
  • Diameter / Dimension: 6mm - 82mm
  • Width: 1200mm
  • Height: 1900mm
  • Length: 1500mm
  • Volts: 220
  • Amps: 4

Laser Diode Chip Visual Inspection Machine VVS2000
Laser Diode Chip Visual Inspection Machine VVS2000
Opto System Co. Ltd., Japan
The VVS2000 performs visual inspection on the top side and facets of the laser diode chips. Defects of 1µm or larger are detected on the top while defects of 3µm or larger are detected on the facets. The machine completes optical inspection without the need to pick up diodes from the tape. Defective chips are automatically removed during operation. Images of each laser are analyzed and can be stored in a database for reference and full audit trail.
Optics Compatibility: Spherical
  • Type: Other
  • Diameter / Dimension: 100mm
  • Width: 1350cm
  • Height: 1800cm
  • Length: 1350cm
  • Volts: 230
  • Amps: 1500
  • LD Die length: 250 μm
  • LD Die Width: 250 μm
  • LD Die Thickness: 150 μm
  • Inspection Area: 100mm × 100mm

Laser Diode Cleaver LDH-30TS
Laser Diode Cleaver LDH-30TS
Opto System Co. Ltd., Japan
Opto System LDH-30TS cleaves pre-scribed laser diode bars into chips. This semi-automatic machine is equipped with a vision system that automatically align each bar before cleaving. The combination of this and other features ensures the production of high-quality mirror like facets. This machine can be used for a number of materials including InP and GaAs substrates.
Optics Compatibility: Spherical, Prisms & Wedges
  • Type: Other
  • Diameter / Dimension: 50mm
  • Width: 730mm
  • Height: 1415mm
  • Length: 850mm
  • Volts: 100
  • Amps: 500
  • Wafer Size: 4 inch
  • Power Supply: AC100V 500VA
  • Vacuum: Factory Supply
  • Air Supply: 4Kg/cm2  Φ6mm 2L/m
  • Accuracy: ±0.005mm
  • Optical System: High Magnification Camera

Diamond Scriber OSM-90TS
Diamond Scriber OSM-90TS
Opto System Co. Ltd., Japan
Opto System Diamond Scriber OSM-90TS utilizes a diamond tool to perform die or bar singulation as part of the scribe and break process. This high precision semi-automatic tool produces high quality mirror like facets and is popular for laser diode manufacturing. This machine can be used for a number of materials including Indium Phosphide and Gallium Arsenide substrates.
Optics Compatibility: Spherical, Prisms & Wedges
  • Type: Other
  • Diameter / Dimension: 50mm
  • Width: 710cm
  • Height: 1415cm
  • Length: 870cm
  • Volts: 100
  • Amps: 500
  • Wafer Size: 4 inch
  • Power Supply: AC100V 500VA
  • Vacuum: Factory Supply
  • Air Supply: 4Kg/cm2  Φ6mm 2L/m
  • Accuracy: ±0.005mm
  • Optical System: 4 x Microscope

SPCM-M1
SPCM-M1
Mildex Inc., United States
Model SPCM-M1 lens centering machine uses manual loading of the workpieces and can be equipped with optional video optical alignment system for lenses with weak or long radii.
Optics Compatibility: Spherical
  • Type: Centering & Edging
  • Diameter / Dimension: 2mm - 90mm
  • Width: 1200mm
  • Height: 1450mm
  • Length: 750mm
  • Volts: 220
  • Amps: 4

UPC 300 Ultra Precision Freeform Machine
UPC 300 Ultra Precision Freeform Machine
SCHNEIDER Optical Machines Inc., United States
The compact UPC 300 is a 3-axis machine designed for the highly dynamic machining of freeform surfaces. The optional long stroke Fast Tool increases the productivity in freeform machining. A high-quality optical metrology system allows for the machine integrated contactless measurement of freeform surfaces. Corrective remachining of freeform surfaces is possible to achieve highest precision.
Optics Compatibility: Spherical, Aspherical, Cylindrical, Prisms & Wedges, Freeform
  • Type: Diamond Turning
  • Diameter / Dimension: 0.5mm - 700mm
  • Width: 1900mm
  • Height: 1950mm
  • Length: 1300mm
  • Volts: 400
  • Amps: 40

Spheroline SLC 80
Spheroline SLC 80
SCHNEIDER Optical Machines Inc., United States
Double spindle design allows for simultaneous edge processing. The unique contour control option allows for the measurement of the lens contour while still clamped, enabling corrective machining. The optional laser alignment operates in both transmissive and reflective modes allowing it to be used with all optical materials. The optional robot automation supports non-stop processing.
Optics Compatibility: Spherical, Aspherical, Cylindrical, Prisms & Wedges, Freeform
  • Type: Centering & Edging
  • Diameter / Dimension: 5mm - 80mm
  • Width: 1040mm
  • Height: 2146mm
  • Length: 1187mm
  • Volts: 400
  • Amps: 25

ALP 120 Aspherical Lens Polisher
ALP 120 Aspherical Lens Polisher
SCHNEIDER Optical Machines Inc., United States
High quality polishing of aspheres, utilizing Schneider's advanced polishing system 3D. Perform polishing and form correction in a single process. Easily achieving quarter-wave results with minimal operator training.
Optics Compatibility: Aspherical
  • Type: Polishing
  • Diameter / Dimension: 5mm - 120mm
  • Width: 1220mm
  • Height: 1948mm
  • Length: 1281mm
  • Volts: 400
  • Amps: 30

VCSEL Wafer Package Tester VMSF3000
VCSEL Wafer Package Tester VMSF3000
Opto System Co. Ltd., Japan
VMSF3000 performs optical and electrical characterization of VCSEL chips and VCSEL package devices. The machine measures IL, wavelength, polarization, and FFP. This machine completes optical inspection on the top side of the chip, sort package into different trays, conduct aging for degradation and utilize a golden sample for calibration. Measurement is conducted at controlled temperatures and all data recorded and stored in a file for easy review and analysis.
  • Type: Other
  • Diameter / Dimension: 100mm
  • Width: 1350cm
  • Height: 1700cm
  • Length: 1100cm
  • Volts: 230
  • Amps: 50
  • Wafer Size: 4 inch
  • Weight: 1000 kg
  • Vacuum: Factory Supply
  • Probe Card Size: 4 inch

Laser Diode Breaker LDH-50TSR
Laser Diode Breaker LDH-50TSR
Opto System Co. Ltd., Japan
Opto System LD Breaker LDH-50TSR automatically cleaves pre-scribed laser diode wafers into bars or LD bars to chips. The material is mounted on a ring and flipped; allowing the vision system to automatically align the wafer and cleave the substrate from the back. A support mechanism on the front side secures the structure and allow bending over the breaking street. These features ensure high quality mirror like facets and high yields.
  • Type: Other
  • Diameter / Dimension: 60mm
  • Width: 650cm
  • Height: 1400cm
  • Length: 700cm
  • Volts: 120
  • Amps: 500
  • Wafer Size: 2 inch
  • Chip Size: Minimum 200 μm
  • Wafer Frame: 6-Inch Frame 2-6-1
  • Speed: Maximum 50mm/sec
  • Accuracy: ±0.005mm




1-10 of 67 items  123567
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