Optical Fabrication Equipment | OPTICS & OPTICAL FABRICATION

Model SPCM-M1-AT50 Automatic lens centering machine with integrated robot. This machine can load and unload parts automatically with its integrated robot. Machine is suitable to edge and bevel lenses or windows, up to 82 mm diameter.

The VVS2000 performs visual inspection on the top side and facets of the laser diode chips. Defects of 1µm or larger are detected on the top while defects of 3µm or larger are detected on the facets. The machine completes optical inspection without the need to pick up diodes from the tape. Defective chips are automatically removed during operation. Images of each laser are analyzed and can be stored in a database for reference and full audit trail.

Opto System LDH-30TS cleaves pre-scribed laser diode bars into chips. This semi-automatic machine is equipped with a vision system that automatically align each bar before cleaving. The combination of this and other features ensures the production of high-quality mirror like facets. This machine can be used for a number of materials including InP and GaAs substrates.

Opto System Diamond Scriber OSM-90TS utilizes a diamond tool to perform die or bar singulation as part of the scribe and break process. This high precision semi-automatic tool produces high quality mirror like facets and is popular for laser diode manufacturing. This machine can be used for a number of materials including Indium Phosphide and Gallium Arsenide substrates.

Model SPCM-M1 lens centering machine uses manual loading of the workpieces and can be equipped with optional video optical alignment system for lenses with weak or long radii.

The compact UPC 300 is a 3-axis machine designed for the highly dynamic machining of freeform surfaces. The optional long stroke Fast Tool increases the productivity in freeform machining. A high-quality optical metrology system allows for the machine integrated contactless measurement of freeform surfaces. Corrective remachining of freeform surfaces is possible to achieve highest precision.

Double spindle design allows for simultaneous edge processing. The unique contour control option allows for the measurement of the lens contour while still clamped, enabling corrective machining. The optional laser alignment operates in both transmissive and reflective modes allowing it to be used with all optical materials. The optional robot automation supports non-stop processing.

High quality polishing of aspheres, utilizing Schneider's advanced polishing system 3D. Perform polishing and form correction in a single process. Easily achieving quarter-wave results with minimal operator training.

VMSF3000 performs optical and electrical characterization of VCSEL chips and VCSEL package devices. The machine measures IL, wavelength, polarization, and FFP. This machine completes optical inspection on the top side of the chip, sort package into different trays, conduct aging for degradation and utilize a golden sample for calibration. Measurement is conducted at controlled temperatures and all data recorded and stored in a file for easy review and analysis.

Opto System LD Breaker LDH-50TSR automatically cleaves pre-scribed laser diode wafers into bars or LD bars to chips. The material is mounted on a ring and flipped; allowing the vision system to automatically align the wafer and cleave the substrate from the back. A support mechanism on the front side secures the structure and allow bending over the breaking street. These features ensure high quality mirror like facets and high yields.