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Photonics ProdSpec

Contact Image Sensor Die/Wafer

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Maxwell-Hiqe Corp.
4729 E Sunrise Dr. #201
Tucson, AZ 85718

Full Company Details
Phone: +1 520-225-0334

Contact Image Sensor Die/Wafer
  • Type: CMOS
  • Max. Resolution: 576P
  • Sensor Width: 12
  • Scan Type & Rate: Linear
  • kHz at Max. Res.: 70
  • Light Spectrum: VIS, NIR
  • Die/Wafer: 5000+
  • Resolution (dpi): 1200/600/400/300/200/100
  • Pixel Height: 84 ┬Ám
  • Maximum Clock: 40 MHz

A high performance linear contact image sensor (CIS). A low voltage differential signaling (LVDS) clock interface enables high-speed operation and wide module assemblies with lowe noise. Includes an output amplifier, correlated double sampling (CDS) and a global shutter. Supports external or daisy-chained clocking.
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