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UNIBOND 5.0 Thermoplastic Adhesive

  • Company: Universal Photonics Inc.
  • Type: Adhesives
  • Color: Purple
  • Penetration Test (in): < 0.004
  • Softening Point (°C): 51 - 59
  • Melting Point (°C): 55 - 63
  • Size Availability: Bulk, 2 Bars, Each

The UNIBOND Series of water soluble, thermoplastic adhesives is engineered for temporary bonding and blocking processes in a wide range of metals and ceramics, delivering superior adhesion strength and performance. UNIBOND 5.0 has the lowest melting and bonding temperature in the Series. Most commonly used in lapping, back grinding, wafer bonding, blocking and wafer thinning processes.
UNIBOND 5.0 Thermoplastic Adhesive

Universal Photonics Inc.
85 Jetson Lane
Central Islip, NY 11722
United States
Phone: +1 516-935-4000
Fax: +1 516-935-4039
Toll-free: +1 800-645-7173
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