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Photonics Marketplace / Tresky Corp., Sub. of Dr. Tresky AG

Tresky Corp.
Sub. of Dr. Tresky AG

Map704 Ginesi Dr., Ste. 11A
Morganville, NJ 07751
United States
Phone: +1 732-536-8600
Fax: +1 732-536-0495
Manufacturer of highly flexible die bonding systems with 0.5-micron alignment accuracy. Systems perform flip chip bonding, eutectic die attach, thermosonic, thermocompression, 3D stacking, UV curing, and precise Z height control with bond-line thickness. Manual, semi-, and fully-automatic systems available.
Established: 1980
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