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Photonics Buyers' Guide / Tresky Corp., Sub. of Dr. Tresky AG

Tresky Corp.
Sub. of Dr. Tresky AG

704 Ginesi Dr., Ste. 11A
Morganville, NJ 07751
United States
Phone: +1 732-536-8600
Fax: +1 732-810-0433
Manufacturer of highly flexible die bonding systems with 1-micron alignment accuracy. Systems perform flip chip bonding, eutectic die attach, thermosonic, thermocompression, 3D stacking and precise Z height control with bond-line thickness.

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