Search Menu
Photonics Media Photonics Marketplace Photonics Spectra BioPhotonics Vision Spectra Photonics Showcase Photonics ProdSpec Photonics Handbook
We will be upgrading our web servers over the weekend and may experience some downtime as a result. We apologize for any inconvenience.
Photonics Buyers' Guide / Tresky Corp., Sub. of Dr. Tresky AG

Tresky Corp.
Sub. of Dr. Tresky AG

Map704 Ginesi Dr., Ste. 11A
Morganville, NJ 07751
United States
Phone: +1 732-536-8600
Fax: +1 732-810-0433
Manufacturer of highly flexible die bonding systems with 1-micron alignment accuracy. Systems perform flip chip bonding, eutectic die attach, thermosonic, thermocompression, 3D stacking, and precise Z height control with bond-line thickness.
Established: 1980

back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2022 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, [email protected]

Photonics Media, Laurin Publishing
x Wish you were here? Click to become an exhibitor today.
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.