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MY-CHIP PRODUCTION GMBH
Prof.-Hermann-Klare-Str. 6
D-07407 Rudolstadt
Germany
Phone: +49 3672 4782 60
Fax: +49 3672 4782 65
Service contracting for slicing and grinding wafers of brittle material including sapphire, Si, SiC, GaAs, GaN, GaP, InP, glass, quartz, piezo, magnets and others.

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