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Boxberger Str. 14
D-12681 Berlin
Phone: +49 3093 66810
High accuracy bonders for photonics packaging and die attach. Bonding of laser bars and diodes, VCSELs, MEMs, sensors, flip chips, copper pillar, etc. Submicron placement accuracy with a single platform that handles thermocompression, thermosonic, eutectic, epoxy, ACF and indium bonding. Process flexibility suitable for R&D through production.
Established: 1992
Ownership type: Privately Owned
Green Manufacturing Green Manufacturing
Green Facility Green Facility

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