560 E Germann Rd. #103
Gilbert, AZ 85297
High accuracy bonders for photonics packaging and die attach. Bonding of laser bars and diodes, VCSELs, sensors, PICs, LEDs, Si photonics, TOSA/ROSA, etc. Submicron placement accuracy within a single platform that handles thermocompression, thermosonic, eutectic, epoxy, ACF and indium bonding. Manual, motorized and automated models available.
Ownership type: Privately Owned
FINETECH PRODUCT AND SERVICE CATEGORIES
MS=Manufacture Stock | MC=Manufacture Custom | S=Supply/Distribute | D=Design