2017 Flex Europe

By co-locating with Europe’s largest semiconductor manufacturing event and held in cooperation with the Fraunhofer EMFT’s forum BE-FLEXIBLE 2017, the FLEX Europe Conference takes advantage of the intersection of PE and thin silicon (Si) devices.

Key technical topics are expected to be covered such as: thin silicon, flexible sensors, heterointegration on flex, bendable electronics, reliability of flexible electronics, and robotics.