Search
Menu
Society for Information Display - Display Week 2024 Web LB 3/24

Design, Test, Integration & Packaging (DTIP) of MEMS/MOEMS 2014

Facebook X LinkedIn Email
April 1, 2014 - April 4, 2014
Cannes, France
CMP
33 4 76 57 46 22

About this Event
This series of symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. A special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems.


industrialIndustry EventsEurope
SPIE - Smart Structures 2024 MR 1/24
Edge AI and Vision Alliance - Embedded Vision Summit 2024 MR 3/24
P.E. SCHALL GmbH & Co. KG - Control 2024 MR Animated
Photonics Marketplace
Search more than 4000 manufacturers and suppliers of photonics products and services worldwide:

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.