OIDA Workshop on Developments in Co-Packaging Technologies for Data Centers

Data centers will increasingly rely on embedded photonics for enhanced connectivity between servers, memory, and computational systems. Furthermore, the integration of photonic functionality onto a single chip and co-packaged with electronics is a path to increase bandwidth and operational efficiencies even more, addressing many of the emerging challenges on data center roadmaps. However, even though embedded photonic technologies have been shown to meet much lower link and switch budgets when compared to conventional electronic technologies, their widespread deployment is still impeded by significant technical, manufacturing and cost barriers.

This workshop will review emerging trends for data centers and critical challenges embedded photonics must overcome to be considered a viable mass market technology. The workshop will include invited talks from leading decision makers with responsibility for the development of next generation data centers, presenting their key technology and cost requirements. The workshop will also have invited speakers from leading photonic companies and service providers who are developing innovative products and advanced manufacturing services to meet these emerging requirements. The workshop will provide an opportunity for attendees to contribute to the discussion through interactive panel sessions.

This OIDA workshop will be the 10th in a series on topics important to the commercialization of new optical communications components and equipment, particularly for the manufacture of integrated photonics as the next platform for optical communications.