OIDA Workshop on Integrated Photonics High Volume Packaging 2016

Progress continues on the design and clean room fabrication of integrated photonics, and companies have commercialized products based on integrated photonics on both the InP and silicon platforms. There is growing awareness that the chip fabrication is less of a barrier to commercialization, and attention is increasingly turning to the cost of the overall package. This cost includes the bill of materials of the package itself, the amortized cost of assembly tools, and labor. Addressing the cost requires an examination of the entire ecosystem, from the chip design and fabrication to the assembly and surrounding electronics.