Test & Measurement

Precision optical glass: strip, blanks, pressings, polished balls, near-UV transmitting i-Line glass, ceramic substrates, CaF2, UV/IR materials, quartz, fused silica (standard/excimer grade), Nanoceram. Ohara CCZ ultralow expansion (excellent CTE uniformity, blank form, to 1.8 m diam). Double-side polished substrates (low surface roughness, excellent flatness).

Manufactures precision optical glasses: strip/slab, blanks, fine gobs, polished ball lenses, near-UV transmitting i-Line glass, ceramic substrates, CaF2, UV/IR materials, quartz, fused silica (std./excimer grade). Ohara CCZ ultralow expansion (excellent CTE; large size). Nanoceram. Double-side polished substrates (low surface roughness, excellent flatness).

Manufacturer of precision optical components and high-power laser coatings from UV to IR. Stock and custom optics: lenses, beamsplitters, filters, windows, mirrors, wave plates, large wedges, prisms, and many more. In-house custom coatings: AR, high reflection, dichroic, and polarizing. Optics from 4 mm to 16 inches.

Manufacturer of air-spaced and solid etalons, ultrahigh damage threshold laser optics and interferometer optics. Coatings from UV to near-IR. Optomechanical systems.

AS9100/ISO 9001 manufacturer of substrates, wafers, flat optics, precision shims/spacers, 0.127-mm sq to 450-mm diameter. Precision lapping, polishing, dicing, 5-axis CNC machining, small diameter core drilling, hole drilling. Ultrathin 10-20 microns, ultraflat, tight tolerances. Fused silica, glass, sapphire, ceramics, metals. Large inventory.

LaserPoint manufactures laser power and energy meters for laser measurements with high accuracy up to multi-kilowatts optical power level. We also provide patented high-tech solutions to measure ultrafast lasers down to femtosecond pulse duration and high repetition rates up to MHz range.

Yelo designs and builds burn-in, life-test and characterization systems for probed devices such as VCSEL arrays, laser arrays, APDs, chip-on carrier devices including photonics integrated circuits (lasers, amplifiers, modulators, photodiodes, thermistors), SOAs, laser arrays, PIN photodiodes, VCSEL TO headers, miniDILs, and butterfly packages.