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Flat Optics: Considerations When BuyingFlat Optics: Considerations When Buying
Michael Naselaris, Sydor Optics Inc.
Flat optics generally perform three main functions: They transmit light (windows), reflect light (mirrors), and fold light (prisms). While most optical manufacturers make spherical and flat optics, a...
Optical Materials: Double-Sided Lapping and PolishingOptical Materials: Double-Sided Lapping and Polishing
Michael Naselaris, Sydor Optics Inc.
Double-sided processing is a batch-type process that uses planetary action — generally with loose, abrasive particles suspended in a liquid vehicle — to abrade material almost equally...
Passive Athermalization: Maintaining Optical Performance Over TemperaturePassive Athermalization: Maintaining Optical Performance Over Temperature
Janos Engineering, Janos Technology LLC
For rotationally symmetric optical systems, either the lens or the detector moves along the optical axis to maintain optical performance. If the compensating axial motion is accomplished without the...
Cleaning Optics: Choosing the Best MethodCleaning Optics: Choosing the Best Method
CVI Laser Optics
Optics can be contaminated in many ways. Contamination can be kept to a minimum by returning the optics to their case after use or by covering the optics for protection from the outside environment....
Optical System Design: Keeping the Coatings in MindOptical System Design: Keeping the Coatings in Mind
JDSU
An optical coating engineer is frequently confronted with a difficult specification for a coating. Often the difficulty in the specification results from the particular form of the optical system. If...
Acousto-Optic DevicesAcousto-Optic Devices
ACOUSTO-OPTIC SCANNING DEVICES: CHARACTERISTICS MODULATORS Material Bandwidth (MHz) Rise Time (ns) Acousto Input Power (W) (Saturation) Material Wavelength Range...
Diamond Machining: Ultraprecision Machine TechnologyDiamond Machining: Ultraprecision Machine Technology
Engineering Staff, AMETEK Precitech, Inc.
Ultraprecision machining can be defined in general terms as the removal of material from a substrate utilizing a machine tool that operates at a resolution of 10 nm (0.4 μin.) or less. The...
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