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WHITE PAPER: History and Future of Photonics Alignment Automation, Test & Assembly of SiP Components (10/4/2017)

WHITE PAPER: History and Future of Photonics Alignment Automation, Test & Assembly of SiP Components

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Wednesday, October 4, 2017

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History and Future of Photonics Alignment Automation, Test & Assembly of SiP Components

Since first securely linking computers 40 years ago, optical fibers were broadly adopted in smaller and smaller applications over time to the most recent application as a data link from one chip to another. The diminishing of scale is also seen in research and industrial laboratories with a goal to eliminate copper as the default interconnect as fiber promises bounties of capacity, throughput, parallelism, scalability, and energy savings. The semiconductor industry is the most recent fiber adapter.

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