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PI Physik Instrumente - Semiconductor Applications 5/24 ROS LB
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WHITE PAPER: New Approach for High Reliability, Low Loss Splicing between Silica and ZBLAN Fibers (3/5/2020)

WHITE PAPER: New Approach for High Reliability, Low Loss Splicing between Silica and ZBLAN Fibers
This paper presents results obtained by using the high thermal expansion coefficient of the ZBLAN fiber to encapsulate a smaller SiO2 fiber.
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Thursday, March 5, 2020
         
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New Approach for High Reliability, Low Loss Splicing between Silica and ZBLAN Fibers

This paper presents results obtained by using the high thermal expansion coefficient of the ZBLAN fiber to encapsulate a smaller SiO2 fiber. A CO2 laser glass processing system was used to control the expansion and contraction of the ZBLAN material during the splicing process for optimum reliability.

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New Approach for High Reliability, Low Loss Splicing between Silica and ZBLAN Fibers
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