Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn

FAST-CURING EPOXY

Photonics Spectra
Oct 2001
Emerson & Cuming Microwave Products Inc.Request Info
 
A medium-viscosity epoxy glob top from Emerson & Cuming provides suitable adhesion to flexible and rigid polymeric substrates, including gloss or matte epoxy, polyester and polyimide. The new 50400-1 is recommended for chip-on-board applications such as smart-card modules. The epoxy can cure in 30 min. at 120 °C in a convection oven or in 5 min. at 120 to 130 °C in an IR oven, resulting in lower stress on the substrate. The one-component system requires no mixing or weighing and can be applied with manual or automatic dispensing equipment.


REQUEST INFO ABOUT THIS PRODUCT

* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address:
Address 2:
City:
State/Province:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2017 Photonics Media
x Subscribe to Photonics Spectra magazine - FREE!