Dec 2001CVI Melles GriotRequest Info
CVI Laser Corp. uses a diamond-blade saw to dice colored glass or combination colored glass filters to low chip edges from 20 to 50 µm. Suitable for use as broadband, bandpass or long-wave pass filters, they cover the UV to near-IR wavelength regions in semiconductor applications.
Production sizes range from 0.5 to 3 mm thick and from 1 to 150 mm long. The filters are available in customized sizes and substrate specifications, and they can be polished or coated according to individual requirements, including antireflection coating.