Feb 2002Electro Scientific Industries Inc. (ESI)Request Info
A laser microvia drill for high-density interconnect and integrated circuit packaging has been launched by Electro Scientific Industries Inc. The Model 5385 features a high-power CO2 laser with a repetition frequency of up to 100 kHz. It is suitable for drilling 75- to 200-µm vias and can produce >12,000 vias per minute in glass-reinforced resin dielectric material. The drill incorporates a compound beam positioner that enables seven axes of coordinated motion control.