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WAFER POLISHING

Photonics Spectra
May 2002
Plan Optik AGRequest Info
 
Plan Optik GmbH has developed structuring and polishing methods for glass and fused silica wafers. The ultrasonic high-speed drilling method can be used for prototypes and for high-volume production. It replaces ultrasonic drilling and, according to the company, provides improved tolerances and process performance. The polishing technique, which is almost free of microdamage, prepares substrates for etching. The wafers have a minimum thickness of 80 µm and a maximum diameter of 12 in.


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