Request InfoPlan Optik AGPlan Optik GmbH has developed structuring and polishing methods for glass and fused silica wafers. The ultrasonic high-speed drilling method can be used for prototypes and for high-volume production. It replaces ultrasonic drilling and, according to the company, provides improved tolerances and process performance. The polishing technique, which is almost free of microdamage, prepares substrates for etching. The wafers have a minimum thickness of 80 µm and a maximum diameter of 12 in.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 1/12/2023A Proven, Portable, and PIC-Based Methodology for Cultivating a Next-Generation WorkforceWith the passage of the CHIPS and Science Act and growing demand for photonic integrated circuit technology, the semiconductor industry is once again gaining momentum. But even as the U.S. rebuilds...Photonics.com 3/27/2024Precision Planning: Simplified Laser Scanning with Predictive SoftwareConventional controllers for laser scan systems do not allow to predict the actual path of the laser beam on the work piece. A tedious process of testing different parameters and delay settings...Photonics.com 7/20/2023Motorized and Calibrated Lenses for Machine Vision ApplicationsMany applications have benefited from motorized varifocal lenses that allow automatic or remote adjustment of focus distance and field of view. Applications may need to change the focal length or...Photonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...