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LAPPING MACHINE

Photonics Spectra
Sep 2002
Logitech Ltd.Request Info
 
Logitech offers a precision lapping machine for use with delicate and brittle materials, such as III-V and II-VI semiconductors and sapphire wafers, that must be processed in bulk to precise tolerances. The Next Generation System is designed to handle high-precision angle polishing for producing optical network components, including arrayed waveguides, and for thinning substrates for integrated circuits. It has four automated load/unload workstations with processing arms that can be individually lowered or removed. The company says this allows different batches of materials/components to be run together on the same processing plate for reduced downtime and increased efficiency.


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