Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn

LAPPING MACHINE

Photonics Spectra
Sep 2002
Logitech Ltd.Request Info
 
Logitech offers a precision lapping machine for use with delicate and brittle materials, such as III-V and II-VI semiconductors and sapphire wafers, that must be processed in bulk to precise tolerances. The Next Generation System is designed to handle high-precision angle polishing for producing optical network components, including arrayed waveguides, and for thinning substrates for integrated circuits. It has four automated load/unload workstations with processing arms that can be individually lowered or removed. The company says this allows different batches of materials/components to be run together on the same processing plate for reduced downtime and increased efficiency.


REQUEST INFO ABOUT THIS PRODUCT

* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address:
Address 2:
City:
State/Province:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2017 Photonics Media
x Subscribe to Photonics Spectra magazine - FREE!