Oct 2002Rudolph Technologies Germany GmbHRequest Info
NanoPhotonics' Ellipson laser ellipsometer autoalignment system is designed for integration into nitrogen-purged front-end modules of process equipment for measuring ultrathin gate oxide and nitride as well as ultrathin high-k materials such as hafnium and aluminum oxide. The device can measure blanket film thicknesses from 3 µm to below 10 Å, with 0.03-Å repeatability. It accommodates bowed wafers and wafer sizes up to 300 mm. The system is equipped with automatic tool-matching, edge-gripping, notch-detection and remote-control software. Options include a wafer ID reader and notchaligning.