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THIN-FILM MEASUREMENT

Photonics Spectra
Oct 2002
Rudolph Technologies Germany GmbHRequest Info
 
NanoPhotonics' Ellipson laser ellipsometer autoalignment system is designed for integration into nitrogen-purged front-end modules of process equipment for measuring ultrathin gate oxide and nitride as well as ultrathin high-k materials such as hafnium and aluminum oxide. The device can measure blanket film thicknesses from 3 µm to below 10 Å, with 0.03-Å repeatability. It accommodates bowed wafers and wafer sizes up to 300 mm. The system is equipped with automatic tool-matching, edge-gripping, notch-detection and remote-control software. Options include a wafer ID reader and notchaligning.


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