Dec 1997Resonetics LLCRequest Info
Resonetics Inc. announces a noncontact silicon wafer cutting technique,
using a new laser process to cut patterns such as arcs, curves, circles
and rectangles. Key features include narrow kerf widths and cutting
speeds comparable to traditional straight-line dicing techniques.
Typical applications include dicing optoelectronic circuits such as
wavelength division multiplexers, microelectronics packaging,
solid-state high-voltage components and other components requiring
precise nonlinear work.