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WAFER CUTTING

Photonics Spectra
Dec 1997
Resonetics LLCRequest Info
 
Resonetics Inc. announces a noncontact silicon wafer cutting technique, using a new laser process to cut patterns such as arcs, curves, circles and rectangles. Key features include narrow kerf widths and cutting speeds comparable to traditional straight-line dicing techniques. Typical applications include dicing optoelectronic circuits such as wavelength division multiplexers, microelectronics packaging, solid-state high-voltage components and other components requiring precise nonlinear work.


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