Request InfoResonetics LLCResonetics Inc. announces a noncontact silicon wafer cutting technique, using a new laser process to cut patterns such as arcs, curves, circles and rectangles. Key features include narrow kerf widths and cutting speeds comparable to traditional straight-line dicing techniques. Typical applications include dicing optoelectronic circuits such as wavelength division multiplexers, microelectronics packaging, solid-state high-voltage components and other components requiring precise nonlinear work.See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra April 2024 IssueCommunication AnalyzerThe QCA Series High-Speed Communication Analyzer from Quantifi Photonics is a digital sampling oscilloscope designed for helping manufacturers to scale production to high volumes. 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