Nov 2002Leica Microsystems AG, Industry Div.
New software from Leica Microsystems AG has extended the capabilities of the company's INS3300 modular inspection and review station for applications such as direct-write lithography and process control of 300- and 200-mm wafers. SpotCheck automates inspection of critical sites on wafers for process irregularities and for system defects, such as overlay shift and those already on the reticle or mask. It detects particles, extra pattern and probe mark position errors. The company says that when used with its optional ADC NT/DUV software, the device can classify defects automatically, quickly and accurately, with high optical resolution.