Request InfoMKS/NewportThe MRSI-5005 advanced packaging work cell is offered by Newport Corp. This packaging system combines GaAs die handling and flip-chip bonding for component attachment applications with MEMS and with RF, microwave and millimeter-wave modules. It also is suitable for thermal compression flip bonding. Features include placement accuracy of ±5 µm, 360° random die orientation, substrate alignment, programmable controlled force and automatic tip changing. The MRSI-5005 accepts parts in cassette-to-cassette handling mode, wafer pickup, waffle and gel packs, and tape feeders.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...Photonics.com 3/27/2024Precision Planning: Simplified Laser Scanning with Predictive SoftwareConventional controllers for laser scan systems do not allow to predict the actual path of the laser beam on the work piece. A tedious process of testing different parameters and delay settings...Photonics.com 1/12/2023A Proven, Portable, and PIC-Based Methodology for Cultivating a Next-Generation WorkforceWith the passage of the CHIPS and Science Act and growing demand for photonic integrated circuit technology, the semiconductor industry is once again gaining momentum. But even as the U.S. rebuilds...Photonics.com 1/18/2018Fiberguide RARe Motheye Fiber: Random Anti-Reflective (RARe) Nanostructures on Optical Fibers as Replacement for AR CoatingsAnti-reflective (AR) coatings are now entering their second century and have remained virtually unchanged throughout their life. As power level and wavelength range requirements continue to increase,...