Jan 2003Logitech Ltd.Request Info
Logitech says its CDP polishing machine produces laser-quality surfaces and improves surface topography. Designed for delayering and chemical mechanical polishing, the system allows nanometer-level removal on an individual die or on wafers up to 8 in. in diameter. It is suitable for applications such as hard-substrate polishing, epi-ready surface preparation and wafer reclamation. The CDP system, which can be used with acid and alkaline slurries, features a 20-in.-diameter processing plate, a wafer/die carrier and an independent conditioner head.