WAFER PROCESSING
EV Group (EVG)Request Info
EV Group offers the EVG 120 resist coating and development system for MEMS, advanced packaging, compound semiconductors, power devices and nanotechnology. The system can integrate up to two spin modules and has a robot handling system that provides a throughput of 120 wafers per hour. It allows quick changeover to various wafer sizes and can be tooled for diameters of 50 to 300 mm. Positive and negative resists, polyimides, thin-resist layers and high-viscosity resists can be processed. The bake, chill and vapor modules can be reconfigured for specific applications.
https://www.evgroup.com
/Buyers_Guide/EV_Group_EVG/c4622
Published: February 2003
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