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TWO-COMPONENT EPOXY

Photonics Spectra
Jan 1997
Master Bond Inc.Request Info
 
Master Bond Inc.'s Polymer Adhesive EP21AR was designed for high-performance bonding in applications where high chemical resistance is required. This epoxy is resistant to strong acids, alkalis, water, salts and organic solvents, and it cools at room temperature with a 2:1 mix ratio by weight. It has a 2000-psi bonding strength and is relatively insensitive to mixing ratio or to substrate
cleaning procedures. The EP21AR operates over temperatures from 260 to +250 °F. When hardened, it acts as an electrical insulator.


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