Request InfoGT Advanced Technologies, Advanced Materials GroupFixed abrasive slicing technology equipment has been designed by Crystal Systems for use in the optics, optoelectronics and semiconductor industries. The machines employ a fixed diamond abrasive on wire for fast and precise slicing. They feature speeds up to 5000 rpm and minimum contact length with the wires, increasing the pressure between the diamond particles and the workpiece. Crystals are sliced into wafers using a diamond-plated wire pack made by Saint-Gobain Abrasives. 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