May 2004IPG Photonics, Microsystems Div.Request Info
For LED lift-off applications in the compound semiconductor and wafer fabrication industries, JPSA Laser has unveiled its IX-1000 ChromaLift. The excimer laser system enables the manufacturer to grow GaN LED thin-film devices on the sapphire wafer and then transfer them to a heat sink electrical interconnect, eliminating the wafer scribing step. The system homogenizes the laser beam profile and fires through the back of a sapphire wafer to debond the GaN LED device and to transfer it to a substrate where it can be packaged onto a heat sink and/or an optical reflector. The system includes PC-controlled power meters, a beam profilometer and Windows 2000 software. Area per shot is up to 1 × 1 cm, in either step-and-repeat or fire-on-the-fly mode.