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SOLDER BOND INSPECTION

Photonics Spectra
Oct 2004
Olympus Scientific Solutions Americas, Industrial MicroscopesRequest Info
 
A handheld solder bond inspection tool is available in two configurations from Olympus Industrial America. The SolView-90, laterally configured, is placed beside components to allow inspection under surface-mount devices to determine the integrity of the bond. The portable instrument has an entrance pupil height of 0.3 mm, a wide-field-of-view optical inspection system and high-intensity LED illumination. SolView-00 is a direct viewing instrument for general component inspection. Accessories include digital CCTV equipment, a laboratory bench stand and an X-Y-Z stage.


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