SOLDER BOND INSPECTION
Oct 2004Olympus Scientific Solutions Americas, Industrial MicroscopesRequest Info
A handheld solder bond inspection tool is available in two configurations from Olympus Industrial America. The SolView-90, laterally configured, is placed beside components to allow inspection under surface-mount devices to determine the integrity of the bond. The portable instrument has an entrance pupil height of 0.3 mm, a wide-field-of-view optical inspection system and high-intensity LED illumination. SolView-00 is a direct viewing instrument for general component inspection. Accessories include digital CCTV equipment, a laboratory bench stand and an X-Y-Z stage.