Nov 2004Rudolph Technologies Inc.Request Info
The WaferView 325 system from Rudolph Technologies Inc. provides high-throughput, automated detection and classification of macro and submicron defects on the front, back and edge of 300-mm wafers. It incorporates two inspection heads that operate simultaneously and independently, one at 5- and the other at 20-µm sensitivity. The system inspects 100% of the front surface of the wafer for defects 5 µm or larger at more than 50 wafers per hour, and at better than 150 per hour when combined with the 20-µm inspection head. It includes an onboard, integrated ReviewScope microscope for rapid defect review, automated submicron inspection, dispositioning and root-cause analysis.