Request InfoRudolph Technologies Inc.The WaferView 325 system from Rudolph Technologies Inc. provides high-throughput, automated detection and classification of macro and submicron defects on the front, back and edge of 300-mm wafers. It incorporates two inspection heads that operate simultaneously and independently, one at 5- and the other at 20-µm sensitivity. The system inspects 100% of the front surface of the wafer for defects 5 µm or larger at more than 50 wafers per hour, and at better than 150 per hour when combined with the 20-µm inspection head. 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