PACKAGE INSPECTION
Logos Systems Int'lRequest Info
The latest member of Logos Systems International's family of inspection systems for chip-scale packages and ball grid arrays has been released. Octaveo Model 50CSP comes with a 1.3-megapixel on-axis camera and adjustable optics for inspecting solder balls ranging from 0.1 to 0.4 mm in diameter on chips varying from 1 to 7 mm on a side. The software can handle arrays of up to 30 × 30 balls, with any amount of site depopulation desired. The 3-GHz Pentium 4 embedded PC processes chips at a rate of five to 10 parts per second, depending on the test selected.
http://www.logosvisionsystem.com
/Buyers_Guide/Logos_Systems_Intl/c8721
Published: November 2004
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to Logos Systems Int'l by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required