Request InfoLogos Systems Int'lThe latest member of Logos Systems International's family of inspection systems for chip-scale packages and ball grid arrays has been released. Octaveo Model 50CSP comes with a 1.3-megapixel on-axis camera and adjustable optics for inspecting solder balls ranging from 0.1 to 0.4 mm in diameter on chips varying from 1 to 7 mm on a side. The software can handle arrays of up to 30 × 30 balls, with any amount of site depopulation desired. The 3-GHz Pentium 4 embedded PC processes chips at a rate of five to 10 parts per second, depending on the test selected.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 7/19/2022Barcode Reading: The Not-So-Obvious Path to Deep Learning SolutionsWitherspoon discusses how advancements in deep learning technologies are transforming vision-based inspection systems. He shows how others are successfully using barcode reading as a springboard to...Photonics.com 4/19/2023Key Considerations When Utilizing Laser-Induced Breakdown SpectroscopyLaser-induced breakdown spectroscopy (LIBS) is a fast, nondestructive analytical technique that uses a laser to generate a plasma on the surface of a sample, producing emission spectra that can be...Photonics.com 7/20/2021Hybrid AI Reduces Inspection Errors, Costs, and RiskManufacturers and brand owners navigating through the complexities of AI are left with a few key questions: How can AI reduce errors and automate manual tasks? Is algorithm training expensive or...Photonics.com 10/22/2019What You Need to Know About an AM Laser’s Personality: Power Is Not the Complete StoryMost of us are familiar with the many benefits that laser-based additive manufacturing brings to manufacturing, including reduced tooling costs, easier testing of complex geometries, and faster time...PHOTONICS BUYERS' GUIDE CATEGORIESVideo Inspection SystemsNoncontact Optical Inspection SystemsX-Ray Inspection SystemsNoncontact Automatic Inspection Systems