Sep 2005LPKF Laser & Electronics AGRequest Info
LPKF Laser & Electronics AG has released the LPKF MicroCut stencil laser for applications that involve the stencil paste printing of wafers. The laser incorporates a beam-deflection system that enables material focus diameters of 20 µm and the production of sharp contours with radii of up to 10 µm. It cuts shapes at up to 50,000 apertures per hour. The use of LPKF PulseShape technology eliminates thermal effects that cause coining or warpage in high-density and thin stencils. The laser minimizes burrs at exiting edges, eliminating posttreatment processing.