Nov 2005Henkel Electronic Materials LLCRequest Info
Hysol FP4548FC is a high-purity liquid epoxy encapsulant material from Henkel Corp.s Electronics Div. that is designed as an underfill for flip-chip devices that require crack and fracture resistance. Its low coefficient of thermal expansion and low shrinkage properties make it suitable for low k die applications. When fully cured, the material creates a rigid, high-strength seal that dissipates solder joint stress, extends thermal cycling performance and simplifies assembly. It is compatible with lead-free manufacturing requirements and is qualified for JEDEC Level 3/260 °C.