Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn

FLIP-CHIP MATERIAL

Photonics Spectra
Nov 2005
Henkel Electronic Materials LLCRequest Info
 
Hysol FP4548FC is a high-purity liquid epoxy encapsulant material from Henkel Corp.’s Electronics Div. that is designed as an underfill for flip-chip devices that require crack and fracture resistance. Its low coefficient of thermal expansion and low shrinkage properties make it suitable for low k die applications. When fully cured, the material creates a rigid, high-strength seal that dissipates solder joint stress, extends thermal cycling performance and simplifies assembly. It is compatible with lead-free manufacturing requirements and is qualified for JEDEC Level 3/260 °C.


REQUEST INFO ABOUT THIS PRODUCT

* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address:
Address 2:
City:
State/Province:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
Henkel Corp.high-purity liquid epoxy encapsulant materialHysolindustrialNew Products

Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2017 Photonics Media
x Subscribe to Photonics Spectra magazine - FREE!
X
Are you interested in this product?
If you'd like Henkel Electronic Materials LLC to reach out to you with more information about this product, please supply your email and they will contact you.

Email Address:
Stop showing me this for the remainder of my visit