LED WAFER SCRIBING
Dec 2005IPG Photonics, Microsystems Div.Request Info
Using its ChromaDice UV diode-pumped solid-state laser system, J P Sercel Associates (JPSA) has developed and proved the ability to scribe 4-in. LED wafers. ChromaDice performs high-speed wafer scribing with typical yields of greater than 99% and cuts a well-defined chip as small as 2.5 µm. The process offers high throughput, has minimal impact on device performance and is tolerant of wafer warp and bow. The self-contained machine, measuring 60 × 42 in., includes an air-cooled laser, motion control, beam delivery and video inspection. Accuracy is a true, unmapped position radius of 2 µm over a 100 × 100-mm area, with stage orthogonality of better than 2 arc sec.