Custom Optoelectronic Assemblies
Mar 2006Teledyne Microelectronic TechnologiesRequest Info
Teledyne Microelectronics develops advanced microelectronics packaging for high-speed broadband communications, including fiber optic transmitters, receivers, multichannel transceivers and optical assemblies. The company provides low-, medium-, or high-volume miniature optoelectronic packaging design, assembly and test. It specializes in packaging ultradense microminiature devices on a variety of substrates, including LTCC, HTCC and thick/thin film. Advanced packaging techniques include flip chip, chip scale, BGA, SMT and mixed-mode manufacturing; it is ISO 9001:2000 and MIL-PRF-38534 certified.